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HyperSilicon Becomes New Tensilica Prototyping Partner in China

Customers can Build Reference Designs on HyperSilicon’s FPGA-Based Platform

SANTA CLARA, Calif. – December 8, 2008 – Tensilica, Inc. today announced that HyperSilicon Co., Ltd, of Beijing, China, has become its newest SOC (system-on-chip) prototyping partner, supporting customers of both the Xtensa customizable processors and the Diamond Standard processor cores in the growing China market. HyperSilicon has particular expertise in designing FPGA development boards, which are often used to test new chip designs before producing the chip in silicon.

"We have seen great interest in Tensilica’s dataplane processor cores in China," said Thomas Yan, vice president of HyperSilicon. "By working together, we can provide cost-effective Altera FPGA- based boards for SOC emulation before silicon production and reduce verification time."

"Many companies prototype their SOC designs before committing them to silicon to make sure they’ll work properly in the system," stated Chris Jones, Tensilica’s director of strategic alliances. "Hypersilicon’s expertise can help these customers."

About HyperSilicon

HyperSilicon Co., Ltd. is a private held company in Beijing, with a branch office in Shanghai, China. The company supplies FPGA-based rapid prototyping board to SOC/IP designers and the company is the sales agent of some worldwide IP vendors. StarFire series FPGA boards have been widely used in the China market and have helped customers decrease the time to market for various products. As the first and only Development Kit Partner of Altera in China, the company is strong at customizing the FPGA board design.

About Tensilica

Tensilica, Inc., is the recognized leader in customizable dataplane processors.   Dataplane Processor Units (DPUs) consist of performance intensive DSP (audio, video, imaging, and baseband signal processing) and embedded RISC processing functions (security, networking, and deeply embedded control).  The automated design tools behind all of Tensilica's application specific processor cores enable rapid customization to meet specific data-plane performance targets.  Tensilica's DSPs and processors power top tier semiconductor companies, innovative start-ups, and system OEMs for high-volume products including mobile phones, consumer electronics devices (including portable media players, digital TV, and broadband set top boxes), computers, and storage, networking and communications equipment. For more information on Tensilica's patented benchmark-proven DPUs visit www.tensilica.com .

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Editors' Notes:

  • Tensilica and Xtensa are registered trademarks belonging to Tensilica Inc. All other company and product names are trademarks and/or registered trademarks of their respective owners.
  • Tensilica's announced licensees include: ADDMM, Afa Technologies, ALPS, Aquantia, Astute Networks, Atheros, AMD (ATI), Avision, Bay Microsystems, Berkeley Wireless Research Center, Brocade, Broadcom, Cisco Systems, CMC Microsystems, Conexant Systems, Design Art Networks, DS2, EE Solutions, Epson, ETRI, FUJIFILM Microdevices, Fujitsu Ltd., Hudson Soft, iBiquity Digital, Ikanos Communications, Intel, Juniper Networks, LG Electronics, Lucid Information Technology, Marvell, NEC Laboratories America, NEC Corporation, NetEffect, Neterion, Nethra Imaging, Nippon Telephone and Telegraph (NTT), NuFront, NVIDIA, Olympus Optical Co. Ltd., Panasonic Mobile, Penstar, Plato Networks, PnpNetwork Technologies, PowerLayer Microsystems, SiBEAM, Silicon Optix, Sony, STMicroelectronics, Stretch, TranSwitch Corporation, Triductor Technology, u-Nav Microelectronics, UpZide, Valens Semiconductor, Validity Sensors, Victor Company of Japan (JVC), WiLinx, WiQuest Communications, and XM Radio