Accelerating Next-Generation Chiplets and SoCs
Cadence Silicon Solutions leverage decades of experience in IP and subsystems to power your advanced designs. The Cadence Silicon Solutions Portfolio includes silicon-proven Tensilica and Neo AI IP cores, advanced memory interfaces, and high-speed SerDes that are all based on industry-standard protocols. To achieve first-time silicon success, let Cadence help you choose the right IP, subsystem, or silicon solution and capture its full value in your design.
Now you can tackle IP-to-SoC development in a system context, focus your internal effort on differentiation, and leverage multi-function cores to do more, faster. Choosing Cadence Silicon Solutions enables you to design with confidence because you have more freedom to innovate your designs with less risk and faster time to market.
Product Families
Applications
Hyperscale Data Center
Comprehensive 112G/56G and die-to-die connectivity solutions for 400G/800G networks
Automotive
Broad IP portfolio for ADAS, connected vehicle, digital cockpit, and in-vehicle networking
Consumer
Low-power DSP solutions for voice recognition and high fidelity for connected devices and home appliances
IoT & Edge
Low-power processors for audio, vision, sensor fusion, and communications for edge devices
5G and Wireless
Addressing the needs for smart devices and 5G basestations