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Tensilica Reaches Audio/Voice DSP Milestone: Most Widely Licensed Audio Architecture for SOC Design

Licensed by Over 50 Corporations

SANTA CLARA, CA – September 11, 2012 –Tensilica, Inc. today announced that it has licensed its HiFi Audio/Voice DSPs (digital signal processors) to over 50 corporations worldwide, making it the most widely licensed audio architecture for SOC (system-on-chip) design. The HiFi architecture has been designed into smartphones, tablets, personal computers, notebook computers, digital video and still cameras, Blu-ray Disc players, digital terrestrial and satellite radios, automobiles, and game consoles. It is used by half of the top 20 tier one semiconductor companies and numerous systems companies.

“Our HiFi Audio/Voice architecture has become the de facto standard for audio offload in new chip designs because we offer the most extensive library of over 100 audio/voice codecs and enhancement software,” stated Larry Przywara, Tensilica’s senior director of Multimedia Marketing. “We also have the smallest, lowest power specs in the industry, allowing us to meet the increasingly complex audio, voice, and speech requirements.”

A key advantage of the HiFi Audio/Voice DSPs is the simple processor-based programming model. Because of the efficiency of the optimized instructions, software developers can port audio and voice codecs completely in C while maintaining, or surpassing, the performance of assembly on other DSP and CPU architectures. Tensilica has more than 30 partners in its rapidly growing audio/voice ecosystem and the company’s licensees are on track to ship more than one billion HiFi cores per year by 2015.

About Tensilica

Tensilica, Inc. is the leader in dataplane processor IP cores, with almost 200 core licensees. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica’s automated design tools to meet specific and demanding signal processing performance targets. Tensilica’s DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. Tensilica offers standard cores and hardware/software solutions that can be used as is or easily customized by semiconductor companies and OEMs for added differentiation. For more information on Tensilica’s patented, benchmark-proven DPUs visit www.tensilica.com.

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Tensilica is a registered trademark belonging to Tensilica, Inc. All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners.