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Tensilica Baseband DSPs and Dataplane Processors (DPUs) Power LTE/HSPA/3G Multimode Modem IC from NTT DOCOMO, Fujitsu, NEC, and Panasonic Consortium

HiFi Audio DSP Also Integrated in Modem for Voice Processing

Barcelona, SPAIN – February 27, 2012 – Tensilica®, Inc. today announced that the second-generation multi-mode LTE/HSPA/3G (Long Term Evolution) baseband chip design announced last week by NTT DOCOMO features multiple Tensilica dataplane processors (DPUs), including the HiFi Audio DSP (digital signal processor) and the ConnX BBE16 Baseband DSP. As with the first generation NTT DOCOMO-sponsored design now shipping in volume in cell phones and tablets, this chip was co-developed by industry leaders Fujitsu, Panasonic and NEC.

“NTT DOCOMO has been an important partner, and we are very excited about this second-generation design, which reduces the power dissipation through multi-standard integration and incorporates even more key functions for next-generation smartphones and tablets such as TD LTE,” stated Eric Dewannain, Tensilica’s vice president and business unit manager, baseband business unit.

First general LTE smartphones, tablets and dongles incorporating Tensilica DPUs were introduced starting at the end of 2010 and include Fujitsu’s ARROWS X LTE F-05D Smartphone and ARROWS’ Tab LTE F-01D tablet. More LTE-based smartphones, tablets and dongles powered by Tensilica are being introduced at the Mobile World Congress show in Barcelona. NTT DOCOMO is the leading mobile phone operator in Japan and also has a strong presence internationally.

About Tensilica

Tensilica, Inc. is the leader in dataplane processor IP cores. Dataplane processors (DPUs) are a superset of DSPs and CPUs that can scale from tiny micro signal processors to programmable offload accelerators and powerful DSPs. DPUs deliver 10 to 100x the performance because they can be optimized using Tensilica’s automated design tools to meet specific and demanding signal processing performance and efficiency targets. Tensilica’s DPUs power SOC designs at many Tier 1 system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. For more information on Tensilica’s patented, benchmark-proven DPUs visit www.tensilica.com.

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Editors' Notes:

  • Tensilica and Xtensa are registered trademarks belonging to Tensilica, Inc. All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners.
  • Tensilica's announced licensees include:  Afa Technologies, ALPS, Aquantia, Astute Networks, Atheros, AMD, Avision, Bay Microsystems, Brocade, Broadcom, Cavium, Chelsio, Cisco Systems, CMC Microsystems, Conexant Systems, Design Art Networks, EE Solutions, Epson, Fujitsu Ltd., Fujitsu Semiconductor, Huawei, iBiquity Digital, Ikanos Communications, Intel, Juniper Networks, LG Electronics, Lucid Information Technology, Marvell, Maxim, NEC Corporation, Nethra Imaging, Novatek, NuFront, NXP, Olympus Optical Co. Ltd.,  Panasonic Mobile, Plato Networks, PnpNetwork Technologies, PowerLayer Microsystems, QLogic, Samsung, Shanghai High Definition Digital Technology Industrial Corporation SiBEAM, Sirius XM Radio ,Sony, Stretch, TranSwitch Corporation, Triductor Technology, Valens Semiconductor, Validity Sensors, VIA, Victor Company of Japan (JVC), and Wolfson Microelectronics.