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LG Electronics Picks Tensilica’s HiFi Audio DSP and SW Codecs for HDTV

SANTA CLARA, Calif. - August 2, 2011 - Tensilica, Inc. today announced that LG Electronics has selected the HiFi Audio DSP core and several audio codecs for their new digital television (DTV) product line.

Tensilica's HiFi Audio DSP is the most popular audio DSP core on the market and is licensed by five of the top 10 semiconductor companies and many leading system OEMs. The HiFi Audio DSP solution includes over 80 audio decoders, encoders and audio-enhancement software packages for efficient audio processing in applications ranging from low power mobile devices - such as cell phones and MP3 players - to high performance home entertainment systems, set-top boxes, Blu-ray Disc players/recorders, and high-definition televisions. The HiFi Audio DSP is part of Tensilica's growing line of dataplane processors (DPUs) that do the challenging, compute-intensive tasks in SOC (system-on-chip) designs.

"We picked the HiFi Audio DSP for its speed, power, and performance, its C-based programming model, and its completeness as a turnkey solution, including both the hardware and the software codecs we need for medium and high-end DTVs," said Seung Jong Choi, Vice President, LG Electronics. "Moreover, Tensilica offers us an attractive, automated process to customize the HiFi Audio DSP and add our own algorithms to further differentiate our products in highly competitive markets."

"We're excited to have LG - a leader in DTVs - as a repeat customer. LG has now used Tensilica's DPUs both in low-power mobile devices and high-performance DTVs," stated Jack Guedj, Tensilica's president and CEO.  "For our HiFi Audio product line, we, and our audio software partners, are constantly adding new audio codecs and audio pre/post processing solutions such as 3D-Surround, sound field expansion, MIDI synthesis, noise suppression, echo cancellation, VoIP and HD radio. This provides customers like LG the ability to meet new and evolving audio standards."

About Tensilica

Tensilica, Inc. is the leader in customizable dataplane processor IP cores. Dataplane Processor Units (DPUs) combine the best capabilities of CPUs and DSPs while delivering 10 to100x the performance and can be customized using Tensilica's automated design tools to meet specific signal processing performance targets. Tensilica's DPUs  power SOC designs at system OEMs and six out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes, digital still cameras and portable media players), computers, and storage, networking and communications equipment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.

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Editors' Notes:

  • Tensilica and Xtensa are registered trademarks belonging to Tensilica, Inc. All other company and product names are trademarks and/or registered trademarks of their respective owners.
  • Tensilica's announced licensees include:  Afa Technologies, ALPS, Aquantia, Astute Networks, Atheros, AMD, Avision, Bay Microsystems, Brocade, Broadcom, Chelsio, Cisco Systems, CMC icrosystems, Conexant Systems, Design Art Networks, EE Solutions, Epson, Fujitsu Ltd., Fujitsu Semiconductor, Huawei, iBiquity Digital, Ikanos Communications, Intel, Juniper Networks, LG Electronics, Lucid Information Technology, Marvell,  Maxim, NEC Corporation, Nethra Imaging, Novatek, NuFront, Olympus Optical Co. Ltd.,  Panasonic Mobile, Plato Networks, PnpNetwork Technologies, PowerLayer Microsystems, QLogic, Qualcomm Atheros, Samsung, SiBEAM, Sirius XM Radio ,Sony, Stretch, TranSwitch Corporation, Triductor Technology, Valens Semiconductor, Validity Sensors, Victor Company of Japan (JVC), and Wolfson Microelectronics.