Home > News & Events > Press Releases > February 7, 2011

Tensilica Showcases #1 Position in 4G LTE Baseband DSP IP Cores at MWC 2011

Santa Clara, CA - February 7, 2011 - Tensilica, Inc. will stand out at this year's Mobile World Congress (MWC) in Barcelona, February 14-18, 2011, as it has moved into the number one position as the supplier of baseband DSP (digital signal processors) IP (intellectual property) cores for the new generation of 4G LTE (Long Term Evolution) equipment. Eight of the top 15 LTE chipset manufacturers are working with Tensilica's cores for their designs.

Tensilica's baseband DSPs are based on its customizable Xtensa® dataplane processor IP cores. Dataplane Processor Units (DPUs) combine the best capabilities of DSP and CPU while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific signal processing performance targets. This enables Tensilica to offer the widest range of solutions from micro-DPUs/DSPs to assist RTL designs to high-performance DSPs for 4G handset designs and wireless basestations.

"Tensilica has jumped to the number one position in baseband DSP IP cores for LTE because they provide the widest range of solutions for mobile handsets and wireless basestations. They've been able to get these products to market quickly by utilizing their customizable DPU technology," stated Will Strauss, president of Forward Concepts and leading DSP analyst. "And the new BBE64 DSP family they're introducing today will be a major step forward to meet the even greater needs of LTE Advanced."

Impressive Demos at Tensilica's Booth

Tensilica will be showing the following products at their booth, number 1F39 in Hall 1:

-          The laptop LTE data card designed for NTT DOCOMO's rollout of LTE in Japan.

-          The base station on-a-chip designed by DesignArt Networks for LTE.

-          A comprehensive demonstration of an LTE link showing H.264 video transmit/receive running on Tensilica cores and the mimoOn LTE software.

-          Multiple systems using Tensilica HiFi Audio IP cores. Tensilica audio is designed into a large number of Tier 1 smartphones.

Sign Up for Booth Meetings Now

Tensilica will have two private meeting rooms in its booth at MWC. If you are interested in meeting with Tensilica to discuss LTE design or HiFi Audio, please contact your local Tensilica representative or email paula@tensilica.com.

About Tensilica

Tensilica, Inc. is the leader in customizable dataplane processor IP cores. Dataplane Processor Units (DPUs) combine the best capabilities of DSP and CPU while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific signal processing performance targets. Tensilica's DPUs  power SOC designs at system OEMs and six out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes, digital still cameras and portable media players), computers, and storage, networking, wireless base station and communications equipment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.

# # #

Editors' Notes:

  • Tensilica and Xtensa are registered trademarks belonging to Tensilica Inc. All other company and product names are trademarks and/or registered trademarks of their respective owners.
  • Tensilica's announced licensees include:  Afa Technologies, ALPS,  Aquantia, Astute Networks, Atheros, AMD (ATI), Avision, Bay Microsystems, Brocade, Broadcom, Chelsio, Cisco Systems, CMC Microsystems, Conexant Systems, Design Art Networks, EE Solutions, Epson, Fujitsu Ltd., Fujitsu Microelectronics, HiSilicon division of Huawei, iBiquity Digital, Ikanos Communications, Intel, Juniper Networks, LG Electronics, Lucid Information Technology, Marvell,  Maxim, NEC Corporation, Nethra Imaging, NuFront, Olympus Optical Co. Ltd.,  Panasonic Mobile, Plato Networks, PnpNetwork Technologies, PowerLayer Microsystems, QLogic, Samsung, SiBEAM, Sony, Stretch, TranSwitch Corporation, Triductor Technology, Valens Semiconductor, Validity Sensors, Victor Company of Japan (JVC), and Sirius XM Radio.