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HiSilicon, a Division of Huawei, Extends License of Tensilica’s IP Cores, ConnX Baseband Engine, and HiFi Audio DSP for LTE Base Stations and Handsets

Shenzhen, CHINA - February 3, 2011 - Tensilica, Inc. today announced that HiSilicon  Technologies, a division of Huawei, has expanded its license (announced February 9, 2010) for Tensilica's dataplane processors (DPUs), ConnX Baseband Engine (BBE16), and HiFi Audio DSP (digital signal processing) semiconductor IP cores for LTE (Long-Term Evolution) basestations, handsets and other network infrastructure and customer premise equipment.

"Now that we've worked for over a year with Tensilica, we are quite impressed with the capabilities, ease of use, and efficiency in terms of power, performance, and area achieved with Tensilica DPUs," stated Teresa He, vice president of HiSilicon. "We have used Tensilica's Vectra and ConnX BBE16 and they are best-in-class for baseband signal processing and can be optimized to improve speed, power and performance. We have also selected Tensilica's HiFi Audio DSP core, which provides performance at the lowest power and comes complete with software support for the major audio and voice standards."

"We are very pleased that HiSilicon, the leader in LTE networks, has expanded its use of Tensilica DPUs through this multi-year agreement," stated Jack Guedj, Tensilica's president and CEO. "HiSilicon's broad adoption of Tensilica, in both mobile wireless and network infrastructure designs, is a testimonial to the benefits of our ability to achieve best-in-class speed, performance and power that can be rapidly optimized to precisely tailor to each SOC design without compromise."

About Tensilica

Tensilica, Inc. is the leader in customizable dataplane processor IP cores. Dataplane Processor Units (DPUs) combine the best capabilities of DSP and CPU while delivering 10 to100x the performance because they can be optimized using Tensilica's automated design tools to meet specific signal processing performance targets. Tensilica's DPUs  power SOC designs at system OEMs and six out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes, digital still cameras and portable media players), computers, and storage, networking, wireless base station and communications equipment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.

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Editors' Notes:

  • Tensilica and Xtensa are registered trademarks belonging to Tensilica Inc. All other company and product names are trademarks and/or registered trademarks of their respective owners.
  • Tensilica's announced licensees include:  Afa Technologies, ALPS,  Aquantia, Astute Networks, Atheros, AMD (ATI), Avision, Bay Microsystems, Brocade, Broadcom, Chelsio, Cisco Systems, CMC Microsystems, Conexant Systems, Design Art Networks, EE Solutions, Epson, Fujitsu Ltd., Fujitsu Microelectronics, iBiquity Digital, Ikanos Communications, Intel, Juniper Networks, LG Electronics, Lucid Information Technology, Marvell,  Maxim, NEC Corporation, Nethra Imaging, NuFront, Olympus Optical Co. Ltd.,  Panasonic Mobile, Plato Networks, PnpNetwork Technologies, PowerLayer Microsystems, QLogic, Samsung, SiBEAM, Sony, Stretch, TranSwitch Corporation, Triductor Technology, Valens Semiconductor, Validity Sensors, Victor Company of Japan (JVC), and Sirius XM Radio.