Home > News & Events > Press Releases > May 18, 2010

Tensilica Showcases Growth in Japan, Moves to New Location, And Hosts Customer Seminar

YOKOHAMA, Japan  - May 18, 2010 -Tensilica, Inc. today announced that its Japan office has moved to a larger, more easily accessible office building and is celebrating the move and its success in the Japan market with a customer seminar on May 24. Highlights of the seminar include presentations by NTT DOCOMO and Epson, as well as discussions of Tensilica's popular HiFi audio DSPs (digital signal processors) and ConnX Atlas LTE (long-term evolution) reference architecture.

"We've experienced significant growth in Japan as most of the major semiconductor and electronic systems companies in the country have adopted our dataplane processors (DPUs) to help them develop low-power and high-performance, programmable designs while reducing design risk and time-to-market," stated Jack Guedj, Tensilica's president and CEO.

Tensilica recently announced that NTT DOCOMO's LTE handset system-on-a-chip (SOC) employs multiple Tensilica DPU cores. In addition to Docomo, Tensilica's announced major companies in Japan include ALPS, EPSON, Fujitsu Mobile, Fujitsu Semi, NEC Mobile, Renesas, Olympus, Panasonic Mobile, and Sony.

The new office is located at Innotech Building 2F, 3-17-6, Shin-Yokohama, Kohoku-ku, Yokohama, 222-0033, Japan. The telephone number remains unchanged at +81-45-477-3373.

The customer seminar is being held Monday afternoon, May 24, 2010, at the ShinYokohama Kokusai Hotel. For detailed information on attending this seminar, please visit http://www.tensilica.co.jp/news_events/seminar_2010.html

"We are honored to have representatives from NTT Docomo and Epson discuss their design experiences with Tensilica at this seminar," stated Masumi Takahashi, representative director of Tensilica K.K. "Our success is a direct reflection of the success of our customers."

About Tensilica

Tensilica, Inc. is the leader in customizable dataplane processor IP cores. Dataplane Processor Units (DPUs) combine the best capabilities of CPUs and DSPs while delivering 10-100x the performance because they can be customized using Tensilica's automated design tools to meet specific signal processing performance targets. Tensilica's DPUs  power SOC designs at system OEMs and six out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes, digital still cameras and portable media players), computers, and storage, networking and communications equipment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.

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Editors' Notes:

  • Tensilica and Xtensa are registered trademarks belonging to Tensilica Inc. All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners.
  • Tensilica's announced licensees include:  ADDMM, Afa Technologies, ALPS,  Aquantia, Astute Networks, Atheros, AMD (ATI), Avision, Bay Microsystems, Blue Wonder, Brocade, Broadcom, Cisco Systems, CMC Microsystems, Conexant Systems, Design Art Networks, DS2, EE Solutions, Epson, ETRI, FUJIFILM Microdevices, Fujitsu Ltd., Fujitsu Microelectronics Ltd., the HiSilicon division of Huawei, Hudson Soft, iBiquity Digital, Ikanos Communications, IDT, Intel, Juniper Networks, LG Electronics, Lucid Information Technology, Marvell,  NEC Laboratories America, NEC Corporation, Neterion, Nethra Imaging, Nippon Telephone and Telegraph (NTT), NuFront, NVIDIA, Olympus Optical Co. Ltd.,  Panasonic Mobile, Penstar, Plato Networks, PnpNetwork Technologies, PowerLayer Microsystems, QLogic, Samsung, SiBEAM, Sony, STMicroelectronics, Stretch, TranSwitch Corporation, Triductor Technology, UpZide, Valens Semiconductor, Validity Sensors, Victor Company of Japan (JVC), WiLinx, Wolfson Microelectronics, and XM Radio.