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Multiple Tensilica IP Cores Power NEC, Fujitsu and Panasonic Mobile Communications Fully Functional LTE Handset SOC for Major Japanese Wireless Carrier

Tensilica's IP Cores Enable Fast Development Time and First-Time Functional Silicon.

SANTA CLARA, Calif. - March 22, 2010 - Tensilica, Inc. today announced that NTT DOCOMO has confirmed that several Tensilica Xtensa LX dataplane processor cores (DPUs) are used in the latest LTE (Long-Term Evolution) mobile handset system-on-chip (SOC) design demonstrated in February at the Mobile World Congress (Barcelona, Spain). NTT DOCOMO previously exhibited the device developed under a collaborative project among DOCOMO, Fujitsu, NEC and Panasonic Mobile Communications (Panasonic Mobile), who will deploy the chip for their LTE handsets and datacards.

"Tensilica's DPUs helped us pack the LTE functions in a small and power-efficient footprint, and they contributed greatly to the efficient implementation and first-time silicon success of our LTE chip," stated Toshio Miki, Associated Senior Vice President & Managing Director of Communication Device Development Department of NTT DOCOMO. "We also achieved a faster time to market and gained post-silicon flexibility due to programmability without sacrificing power or area efficiency."

"The DOCOMO project is clearly leading the race to bring LTE technology to the market, and we are delighted to have had the opportunity to contribute to this rapid and successful development, which was demonstrated integrated into an LTE terminal and an LTE datacard at last month's Mobile World Congress," stated Jack Guedj, Tensilica's president and CEO. "The project proves that our Xtensa DPUs provide both programmability and speed/power efficiency to help designers meet the high performance requirements of LTE wireless modems."

About Tensilica

Tensilica, Inc. - the leader in customizable dataplane processors IP cores. Dataplane Processor Units (DPUs) combine the best capabilities of CPUs and DSPs while delivering 10-to-100-times the performance because they can be customized using Tensilica's automated design tools to meet specific signal processing performance targets. Tensilica's DPUs  power SOC designs at system OEMs and five out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes, digital still cameras and portable media players), computers, and storage, networking and communications equipment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.

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Editors' Notes:

  • Tensilica and Xtensa are registered trademarks belonging to Tensilica Inc. All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners.
  • Tensilica's announced licensees include:  ADDMM, Afa Technologies, ALPS,  Aquantia, Astute Networks, Atheros, AMD (ATI), Avision, Bay Microsystems, Blue Wonder, Brocade, Broadcom, Cisco Systems, CMC Microsystems, Conexant Systems, Design Art Networks, DS2, EE Solutions, Epson, ETRI, FUJIFILM Microdevices, Fujitsu Ltd., Fujitsu Microelectronics Ltd., HiSilicon division of Huawei, Hudson Soft, iBiquity Digital, Ikanos Communications, IDT, Intel, Juniper Networks, LG Electronics, Lucid Information Technology, Marvell,  NEC Laboratories America, NEC Corporation, Neterion, Nethra Imaging, Nippon Telephone and Telegraph (NTT), NuFront, NVIDIA, Olympus Optical Co. Ltd.,  Panasonic Mobile, Penstar, Plato Networks, PnpNetwork Technologies, PowerLayer Microsystems, Samsung, SiBEAM, Sony, STMicroelectronics, Stretch, TranSwitch Corporation, Triductor Technology, UpZide, Valens Semiconductor, Validity Sensors, Victor Company of Japan (JVC), WiLinx, and XM Radio.