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EE Solutions Licenses Diamond Standard 108Mini Processor Core for High Performance, Low Power

SANTA CLARA, CA, –October 17, 2006 –Tensilica, Inc. today announced that EE Solutions (EES) of Hsinchu, Taiwan, a leading design service provider with considerable expertise in SOC (system-on-chip) design, has licensed the Diamond Standard 108Mini processor core for a high-performance, low-power application for one of its customers.

"Tensilica’s Diamond Standard 108Mini core perfectly met our needs for a low-cost, low-power, high-performance controller core for a high-volume customer application in the mobile space," stated Jim Su, chief executive officer of EES. "We evaluated all of the popular 32-bit controller cores on the market, and Tensilica’s Diamond Standard 108Mini gave us the best price,performance and power solution."

"We are pleased that EES picked our Diamond Standard 108Mini over other cores on the market," stated Steve Roddy, Tensilica’s vice president of marketing. "The Diamond Standard 108Mini has set a new industry standard for price and performance in demanding applications."

About EE Solutions

EE Solutions (HsinChu, Taiwan) Inc. is a leading provider of turnkey ASIC and System-on-a-Chip (SoC) design services to integrated circuit and systems companies worldwide. The company is recognized for its engineering background, demonstrated experience in overseas delivery, precision in executing concepts, advanced design and research capabilities, and providing customers with optimal solutions to achieve their business objectives. EE Solutions also offers effective design methodologies and a wide range of advanced intellectual property and professional personnel to help customers step into the ultra-deep-submicron design field. Please visit www.e2-solutions.com.tw for more information.

About Tensilica

Tensilica offers the broadest line of controller, CPU and specialty DSP processors on the market today, in both an off-the-shelf format via the Diamond Standard Series cores and with full designer configurability with the Xtensa processor family. Tensilica’s low-power, benchmark proven processors have been designed into high-volume products at industry leaders in the digital consumer, networking and telecommunications markets. All Tensilica processor cores are complete with a matching software development tool environment, portfolio of system simulation models, and hardware implementation tool support. For more information on Tensilica's patented approach to the creation of application-specific building blocks for SOC design, visit www.tensilica.com.

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Editors’ Notes:

  • Tensilica and Xtensa are registered trademarks belonging to Tensilica, Inc. All other company and product names are trademarks and/or registered trademarks of their respective owners.
  • Tensilica’s announced licensees include Afa Technologies, ALPS, AMCC (JNI Corporation), Aquantia, Astute Networks, Atheros, ATI, Avago Technologies, Avision, Bay Microsystems, Berkeley Wireless Research Center, Broadcom, Cisco Systems, Conexant Systems, Cypress, Crimson Microsystems, ETRI, EE Solutions, FUJIFILM Microdevices, Fujitsu Ltd., Hudson Soft, Hughes Network Systems, iBiquity Digital, Ikanos Communications, LG Electronics, Lucid Information Technology, Marvell, MediaWorks, NEC Laboratories America, NEC Corporation, NetEffect, Neterion, Nethra Imaging, Nippon Telephone and Telegraph (NTT), NVIDIA, Olympus Optical Co. Ltd., PnpNetwork Technologies, sci-worx, Seiko Epson, Solid State Systems, Sony, STMicroelectronics, Stretch, TranSwitch Corporation, u-Nav Microelectronics, Victor Company of Japan (JVC) and WiQuest Communications.