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White Papers

Explore our white papers to get informed and keep up to date on the latest Cadence® IP developments.

Design IP White Papers

A Method to Measure Die Pad Capacitance
Accurately Modeling Transmission Line Behavior with an LC Network-based Approach
Closing the Business Gap with Multi-Protocol PHY IP (by IP-Nest)
Defining a New High-Speed, Multi-Protocol SerDes Architecture for Advanced Nodes
Efficient Verification of Mixed-Signal SerDes IP Using UVM
Enhancing Desktop Virtualization Platforms with Configurable IP Cores
Five Emerging DRAM Interfaces You Should Know for your Next Design
Five Key Challenges in Designing with High-Speed Analog IP
How Design IP Can Simplify Development of Enterprise-Level Communications and Storage Systems
How IP Drives More Integrated Features in Mobile Systems
Improve Reliability and Redundancy of Automotive Ethernet Through Open Standards
Reducing Datacenter Energy Usage Via Power-Saving IP and System Design Techniques
Selecting an Optimized ADC for a Wireless AFE
Six Key Considerations for Choosing the Right Analog IP
Supporting Advanced-Node FinFET SoCs with 16Gbps Multi-Protocol SerDes PHY IP
Testing PSRR with High-Frequency Ripple
Transitioning to USB Type-C with DisplayPort: Key Design Considerations

Verification IP White Papers

Accelerated VIP Verification Approaches White Paper
Analyzing and debugging SoC performance issues
Are You Losing (Out On) Your Memory: Why Memory and Storage Have Reached Their Flashpoint
How Verification IP Can Minimize LPDDR4 PHY IP Verification Complexity
Newport Media and Cadence Success Story
Power-Aware Verification Spans IC Design Cycle White Paper
STM Electronics and Cadence Success Story
Samsung Accelerated VIP Success Story
Samsung and Cadence Success Story
Tackling verification challenges with Interconnect Validator
The Importance of a Verification Strategy and Verification IP in SOC Design Technical Brief
Verification of SSIC Design Using Cadence VIP for SSIC
White Paper: Five Emerging DRAM Interfaces You Should Know for your Next Design
White paper authored by ST Microelectronics

Tensilica Processor White Papers

An Efficient, High-Performance DSP Architecture for W-CDMA Receivers
Choosing the Right DSP for High-Resolution Imaging in Mobile and Wearable Applications
Cut DSP Development Time - Use C for High-Performance, No Assembly Required
Designing and Tuning the Memory Subsystem to Optimize SoC Performance
Developing Cost-Effective, Power-Efficient Active Noise Control Applications with Dedicated DSPs
Developing High-Performance, Low-Power Audio/Voice Subsystems Using Customizable DSP Blocks and Audio Interface IP
Developing Smarter, Safer Cars with ADAS IP
Enabling Embedded Vision Neural Network DSPs
Fixed- and Floating-Point FMCW Radar Signal Processing with Tensilica DSPs
High-Speed Alternatives for Inter-Processor Communications in SOCs
How a Graphical Audio Development Tool Can Simplify Embedded Audio Product Creation
How to Shorten and Simplify Embedded Audio Product Creation
Increasing Processor Computational Performance with More Instruction Parallelism
Keeping Always-On Systems On for Low-Energy Internet-of-Things Applications
Managing Multiple Wireless Standards for Smart Home Applications
Meeting Multiple IoT Application Requirements with a Single, Configurable DSP Core
Optimizing Tensilica Processors for SSD Controllers
Processor IP Power Specifications: A Cautionary Tale
Reduce Development Risk and Add Programmability with RTL-Like Performance and Connectivity
Reducing Latency, Power, and Gate Count with the Tensilica Floating-Point FMA
SLAM and DSP Implementation
Selecting Your Processor or DSP IP— A Checklist
Solve RF/AMS Design Challenges Using the Cadence Virtuoso Solution and Tensilica DSPs
TIE Language—The Fast Path to High-Performance Embedded SoC Processing
Ten Reasons to Optimize a Processor
Tensiica Vision Q6 DSP: The Fifth-Generation Vision and AI DSP
The What, Why, and How of Customizable Processors
Using Convolutional Neural Networks for Image Recognition
Virtually Unlimited I/O Bandwidth