Accelerating Next-Generation Chiplets and SoCs

Cadence Silicon Solutions leverage decades of experience in IP and subsystems to power your advanced designs. The Cadence Silicon Solutions Portfolio includes silicon-proven Tensilica and Neo AI IP cores, advanced memory interfaces, and high-speed SerDes that are all based on industry-standard protocols. To achieve first-time silicon success, let Cadence help you choose the right IP, subsystem, or silicon solution and capture its full value in your design.

Now you can tackle IP-to-SoC development in a system context, focus your internal effort on differentiation, and leverage multi-function cores to do more, faster. Choosing Cadence Silicon Solutions enables you to design with confidence because you have more freedom to innovate your designs with less risk and faster time to market.

Applications

Hyperscale Data Center

Comprehensive 112G/56G and die-to-die connectivity solutions for 400G/800G networks

Automotive

Broad IP portfolio for ADAS, connected vehicle, digital cockpit, and in-vehicle networking

Consumer

Low-power DSP solutions for voice recognition and high fidelity for connected devices and home appliances

IoT & Edge

Low-power processors for audio, vision, sensor fusion, and communications for edge devices

5G and Wireless

Addressing the needs for smart devices and 5G basestations